Monday, December 1, 2025

Pioneering a New Era in Nerve Repair: Featured Talk at Neuro & Neuroscience 2026

The International Conference on Neurology and Neuroscience (NeuroCare 2026) is set to bring together global experts in Singapore and online from March 23–25, 2026. Among the standout sessions is an in-person oral presentation by Peyman Esmaeili Fard Barzegar from Western Sydney University, Australia, showcasing breakthrough research in the field of peripheral nerve repair.

His talk, Innovations in Sutureless Nerve Repair: Combining Bioadhesives and Electrical Stimulation for Enhanced Outcomes,” explores transformative approaches that may redefine how nerve injuries are treated in the future.


Presentation Highlights

  • A shift from traditional suturing to sutureless repair techniques that minimize tissue manipulation and reduce complications.
  • Emerging bioadhesive technologies designed to offer stable, biocompatible nerve bonding with improved alignment accuracy.
  • Electrical stimulation (ES) presented as a scientifically validated enhancer of axonal regrowth and functional recovery.
  • Dual-modality innovation, showcasing how the combination of bioadhesives with ES can accelerate healing beyond current treatment capacities.
  • Compelling preclinical evidence indicating significant improvements in regeneration outcomes using these novel methods.
  • Ongoing translational challenges, highlighting the gap between laboratory success and real-world clinical deployment.
  • Future pathways aimed at integrating advanced biomaterials and neurostimulation into standard nerve repair protocols.

About the Researcher

Peyman Esmaeili Fard Barzegar, a Doctor of Veterinary Medicine (DVM), is pursuing his Ph.D. in neurosurgery, neurosciences, and biotechnology at Western Sydney University. His work focuses on evaluating biomaterials for sciatic nerve and spinal cord repair in rat models.
He also serves as a Laboratory Manager and Research Assistant, with full certification to work with animals in Australia.



Conference Information:


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